Difference between revisions of "Fitlet3 Specifications and block diagram"

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====Dimensions & weight====
 
====Dimensions & weight====
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*'''Standard housing: '''<em>'''132.8 mm''' X '''100 mm '''X '''34.8 mm'''</em>
 
*'''Standard housing: '''<em>'''132.8 mm''' X '''100 mm '''X '''34.8 mm'''</em>
 
*'''Industrial housing: '''<em>'''132.8 mm''' X '''127.5 mm '''X '''25.4 mm'''</em>
 
*'''Industrial housing: '''<em>'''132.8 mm''' X '''127.5 mm '''X '''25.4 mm'''</em>

Latest revision as of 13:20, 17 February 2022

fitlet3 specifications

fitlet3 Block Diagram

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Fitlet3 block diagram.png

CPU

Other pin-compatible CPUs are available for large volume orders. Please contact Compulab to check feasibility.

RAM

  • Up to 32 GB 1x SO-DIMM 204-pin DDR4 Non-ECC DDR4-3200MT/S

Storage

  • M.2 Key-M accepts SATA of NVME modules, 2230, 2242, 2260 or 2280
  • M.2 Key-B accepts SATA M.2 modules or modems, with lengths of 30mm, 42mm, 52mm or 60mm and widths 22mm or 30mm
  • 2.5" HDD/SSD 1

1Demands deep bottom tray and M.2 to SATA expansion

Display

  • mini DP 1.2 | DP 1.2 (up to 4096 x 2160 @ 60Hz) Dual mode
  • HDMI 1.4b | HDMI 1.4b (up to 3840 x 2160 @ 30Hz)

Networking

  • LAN- Up to 4x Gbit Ethernet Intel I210
    • 2x Gigabit on-board Ethernet ports on RJ45 (2x Intel® i210 1000 Mbps / 100 Mbps / 10 Mbps)
    • Additional 2x GbE LAN on RJ45 on FC3-LAN FACET Card
    • Additional 1x GbE LAN on SFP+ for optical LAN on FC3-OPLN FACET Card
    • Additional 1x GbE LAN on RJ45 with PoE device capabilities on FC3-POED FACET Card


Wireless LAN (Optional) 1

  • On-board
  • M.2 Key-E

1 Optional On-board module with Wi-Fi 6E, BT 5.2, for M.2 2230 module with Wi-Fi 6E, BT 5.2


Cellular communication (Optional)

  • LTE/WCDMA/GSM/GNSS
  • M.2 Key-B

Available using M.2 Key-B socket on a fitlet3 SBC for M.2, LTE/5G modem, with micro-SIM tray. fitlet3 SBC is equipped by micro-SIM socket.

I/O

USB

  • 6 on-board ports (2x USB 3.0 + 4x USB 2.0)

Audio (*optional) provided upon request

  • Optional analog output, analog input on 3.5 mm jacks
  • HDMI & DP audio

Serial/GPIO*

  • Isolated serial and GPIO, up to 24V, on terminal block
  • Optional isolated RS-232/422/485
  • 2x isolated GPI + 2x isolated GPO

Extensions

Function and Connectivity Extension T-Card (FACET Card) interface

  • Available FACET-Cards
    • dual Gbit Ethernet
    • 1x PoE
    • 1x SFP+

FACET Card interface includes 2x PCIe, USB, eDP 1.3 and I2C.

  • M.2 E-key socket*

* Shared with FACET Card socket

BIOS & OS

  • BIOS
    • AMI Aptio V
  • Operating systems:
    • Windows 10 Pro
    • Windows 10 LTSC 2021 IoT Enterprise
    • Windows 11 Pro
    • Linux Mint

Compatible with other Windows 10 /11 variants.
Compatible with other Linux variants.
Compatible with other hypervisors and operating systems (e.g. ESXi, FreeBSD)

Operating conditions

Power

  • Input voltage range - DC 7V – 42V
  • Power consumption - 5W – 25W

Power consumption depends on - CPU type - System load - Installed devices - Connected peripherals

Note: fitlet3 is low power Class III (EN/IEC 62368-1 Audio/video, information and communication technology) equipment that is to be powered from external DC Low Power (LPS) unregulated power supply. The external power supply ratings and unregulated voltage boundaries should comply with ones defined in specifications of the specific model. Nominal current rating (A) should be increased if external peripheral devices are to be powered by fitlet3. Compulab delivers fitlet3 with a general purpose 12V 3A AC-DC power adapter that isn’t an integral part of fitlet3 and may be ordered separately as an accessory. In case fitlet3 is powered from another power supply, user should ensure that power supply complies with fitlet3 power requirements. The power connector should meet the following requirements:

  • 5.5 x 2.5mm standard barrel
  • Inner contact – fork type
  • “+” inner contact, “-” outer contact

Temperature & humidity

  • Operating temperature range -Up to -40°C to 85°C*
  • Relative humidity -5% – 95% non-condensing

* When ordered in industrial temperature range. Commercial and extended temperature range are also available. The power supply that ships with fitlet3 is not rated for extended temperatures. Buyer is advised to deploy fitlet3 in extended temperature with a suitable power supply.

Shock and vibration

MIL STD 810G compliant

  • Vibration test:  IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-64 (up to 2 KHz , 3 axis)
  • Shock test:  IEC TR 60721-4-7:2001+A1:03, Class 7M1, test method IEC 60068-2-27 (15g , 6 directions)

Mechanical specifications

Dimensions & weight

Fitlet3 industrial top dimensions.jpg
  • Standard housing: 132.8 mm X 100 mm X 34.8 mm
  • Industrial housing: 132.8 mm X 127.5 mm X 25.4 mm
  • Weight: 420 gram

The user can easily change the housing type in the field.

Housing & cooling

  • All metal housing
  • Aluminium zinc die cast parts
  • Fanless convection cooling through the housing,  no vents

Mounting

  • VESA / wall mounting bracket*
  • DIN-rail mounting bracket*

* Sold separately

Additional features & services

Functional features

  • Auto-on
  • Removable RTC battery
  • Auxiliary power header
  • RTC reset tactile switch
  • Trusted Platform Module (TPM)
  • Remote power button

Firmware & BIOS features

  • PXE boot
  • Wake-on-LAN
  • Wake-on-timer

Mechanical features

  • Kensington lock
  • Power plug twist lock
  • Mechanical disabling of power button

Services

  • OEM rebranding including custom logo and BIOS splash-screen
  • Build-to-order
  • Software imaging
  • Burn-in testing


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