Tensor-I20 terms and abbreviations

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[I20A]

Tensor-I20 The first Intel-based Tensor-I20 model introduced in 2020.

Ribbon

A rigid-flex PCB that connects TEL to TRIP.

RFC

Ribbon Folding Clip.

RLM

Ribbon Latching Mechanism.

SPINE

Abbreviation for Storage, Power, I/O, Networking, Extension cards which are all the families of TELs that can be installed in Tensor-I20.

TEL

Abbreviation for Tensor Element. An extension card for Tensor-I20. Multiple TELs can be installed at the same time.

TIPP

Abbreviation for Industrial Temperature Predictable Performance. A configuration that can operate at a given ambient temperature without throttling the CPU.

TPU

Abbreviation for Tensor Panel Unit. The width of TELs and the width of each Tensor-I20 face are both integer multiple of TPU.

TRIP

Abbreviation for Tensor Ribbon Port. The standard extension port of Tensor-I20. Each Tensor-I20 has multiple TRIPs.

USBTT

Abbreviation for USB TEL to TEL. Operating USB2 TELs from a USB2 port on another TEL