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 thermal compound 
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Joined: Tue Apr 29, 2014 3:20 pm
Posts: 18
Post thermal compound
We've noticed that some fitlet's are coming from the factory with thermal compound between the CPU and the top cover but some are not. Are you going to be standardizing on one way or the other? Just so we know. Thanks


Mon Nov 20, 2017 7:33 pm
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Joined: Mon Mar 16, 2009 2:11 pm
Posts: 2335
Post Re: thermal compound
A while ago we improved the production quality of the heat-plate mounted on the CPU in fitlet (better planarity and surface quality).

Before that we found that thermal compound is required to reduce thermal resistance on that interface but after the change thermal coupling was found to be adequate with dry contact that is more user friendly. This is the current standard.

We do apply thermal compound on fitlet units rated for industrial temperature range only.

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Irad Stavi
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Tue Nov 21, 2017 6:45 am
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