I was rummaging around and found - through the process of building my own on the website - that there are different tops that can get put on the fitlet2.

Standard top-cover
Industrial top-cover [HTI]
Low-profile top-cover [HTL]
Single-board-computer (no housing) [HBPN]

Do you all have pictures/dimensions of each? are they in a format that does not require a special viewer (except for something plain like Adobe)?

I get the idea the no housing one has no clothes, but the others I would like to know more about please. Do they affect the temperature rating? do they have any other features/benefits aside from reducing the profile (as in the low-profile top-cover) or making it look more industrial (for the Industrial top-cover).

If there is a top-cover page you can tell I was not able to find it.

Thanks!!

The fitlet2's mechanical documentation is available at:
http://fit-pc.com/wiki/index.php?title= ... umentation

I saw that page - of all the files there, only the deep bottom cover includes something that does not require a special reader, and it is a handy 3D drafted drawing - that does not really show either how it compares to the normal bottom or how it affects the overall dimensions of the device.

I do not know what a step file is or the other file type.

I am not going to be a pest and demand that you make all of this just for me - but I would imagine if I am looking for this than others who browse your site would be too - but they might leave as it is too hard to get what they need without buying, and instead I am providing the opportunity to perhaps improve the documentation just a little.

The fitlet2 top cover has an important role in thermal dissipation.

* The standard top cover https://fit-iot.com/web/product/fitlet2-standard-top-cover excels in dissipation by natural air convection.

* The Industrial top cover https://fit-iot.com/web/product/fitlet2-industrial-top-cover/ has VESA mounting holes for application where the heat dissipation is done spreading the heat point through thermal coupling to a thermally conductive wall (cabin).

* The Low-profile top coverhttps://fit-iot.com/web/product/fitlet2-low-profile-top-cover/ is not as good as the previous but if dimensions are mission critical and TDP isn't too high, it could come into consideration.

You could find in the links an embedded 3D model you could play around.
Also the mechanical documentation provided earlier, with the right tools, could be used to measure the gaps; Basically any CAD SW should be able to do that.